“Advanced Interconnections Corp. is now offering its new hybrid socket adapter design, which utilizes both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints. The new hybrid socket adapter design offers very low signal attenuation up to 3.5 GHz, and features standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS compliant applications.” Link