BGA-to-BGA adapter solves solder joint reliability problems that occur when RoHS-compliant solder balls are assembled with devices whose connections are not lead-free. Adapter body is made from high-temperature glass reinforced material that allows lead-free components to be mounted at higher temperatures, while eutectic tin-lead ball terminations, which have standard reflow temperatures profiles, enable assembly to be mounted to tin-lead PCB using standard temperatures. More