The International Electronics Manufacturing Initiative’s (iNEMI’s) High-reliability RoHS Task Force has published guidelines regarding assembly processes and reliability requirements for RoHS 5 and RoHS 6 sub-assembly modules related to high-reliability electronics. The task force consists of electronic product manufacturers (OEMs and EMS providers) whose products are characterized by long service life and high-reliability requirements. “Subassemblies are an area of concern because they may contain material(s) or have processes that don’t meet the needs of high-reliability products, such as whisker-prone termination and body finishes; or may have mounting balls (like a BGA) that are SAC and not compatible with the tin/lead assembly processes that will continue to be used by manufacturers producing exempted high-reliability products,” explained Task Force co-chair Mike Davisson, distributed materials engineering manager, Agilent Technologies. More - Source: smt.pennnet.com