“To address the demand for higher current and higher frequency power solutions for DC-DC converters, Toshiba America Electronic Components, Inc. (TAEC)* with its parent company, Toshiba Corporation (Toshiba), today announced that the company has created a multi-chip module (MCM) that combines a driver IC with a MOSFET and Toshiba MOSBD(TM), a single-die combination of a power MOSFET and a Schottky Barrier Diode, in one compact package to achieve greater power output, higher efficiency, a faster response time and improved precision. Toshiba’s TB7001FL MCM device for DC-DC converters are Lead(Pb)-Free(1), and are RoHS-compatible.” Source: prnewswire.com